Fehonda® 1.5W Thermal Pad

Fehonda 1.5W Thermal Pad reduces interface resistance and delivers dependable heat transfer in devices with low-to-moderate heat density. The double-sided self-adhesive construction simplifies assembly and fills microscopic gaps on tight-tolerance surfaces. With Shore C 20–45 compliance, −40 to 180 °C operating range, >6–10 kV/mm dielectric strength and UL94 V-0 compliance, it maintains stability in long-term use. A low-oil-bleed formula and low-permeation option are available. Offered in 0.5–6.0 mm thicknesses.

Suggested applications (for the 1.5W class): home/office networking gear (modems/routers/APs), set-top/TV boxes, media players, NVR/DVR and IP-camera mainboards, IoT gateways, small LED bars/strips, compact embedded CPUs/MCUs, and enclosure contact zones in communication equipment. For direct-contact high-performance CPU/GPU dies, thermal grease is recommended.