Phase Change Materials (PCM)

Fehonda® PCM Series – Phase Change Thermal Materials

The Fehonda PCM (Phase Change Material) series consists of high-performance phase change thermal materials designed to efficiently transfer heat from electronic components to heat sinks or cooling devices.
Its polymer-based, high thermal conductivity formulation softens at the operating temperature (around 52°C) and spreads evenly across the surface.
This phase transition minimizes thermal resistance and ensures maximum heat transfer efficiency.

Fehonda PCM materials can be applied in pad form, it will be shift to grease form when heat applied. Fehonda PCM filling micron-level gaps between heat-generating components and heat sinks to create excellent surface contact.
In addition, they are pump-out resistant — meaning the material does not migrate, ooze, or degrade even after prolonged thermal cycling, maintaining consistent performance for years.

With high temperature tolerance, stable thermal performance, and maintenance-free longevity, Fehonda PCM materials are an ideal choice for professional thermal management systems.

Key Benefits

• High thermal conductivity: Efficient heat transfer up to 8.5 W/m·K

• Low thermal impedance: Minimizes thermal loss across the interface

• Pump-out resistant: Maintains stability during repeated thermal cycles

• Self-activating phase change: Spreads evenly at approximately 52°C

• Excellent surface wetting: Keeps contact resistance extremely low

• Long-term reliability: Proven stability under high temperature and thermal cycling tests

• Easy application: Available in both pad and paste (compound) forms

• Environmentally safe: Metal-free, non-corrosive, and RoHS compliant

Typical Applications

• Processors (CPU / GPU) and high-power ICs

• Power semiconductors (IGBT, MOSFET, converters)

• Memory modules, VRMs, and LED drivers

• Power supplies (UPS, inverter, PSU)

• Motor drivers and automotive control units

• Telecommunication, medical, and industrial control systems

Fehonda PCM Technology

Fehonda’s PCM solutions set a new standard in thermal interface technology through advanced phase change formulation.
When the operating temperature is reached, the material softens and flows to fill micro voids, optimizing the heat transfer path.
Its unique viscosity balance prevents pump-out effects, maintaining form and stability throughout repeated thermal cycles.

Compared to conventional thermal greases, Fehonda PCM materials deliver lower thermal resistance, superior surface conformity, and extended durability — ensuring long-lasting performance in high heat density environments.

The Fehonda PCM Series provides maximum heat transfer efficiency, low thermal impedance, and exceptional long-term stability in demanding thermal environments.
Available in both pad and paste formats, these phase change materials enable electronic systems to operate cooler, safer, and more reliably — without any pump-out issues.