Fehonda® 5.0W Thermal Pad

Fehonda® 5.0W Thermal Pad delivers advanced thermal management for systems demanding high heat dissipation. Its silicone-based composition ensures stable behavior across a −40 °C to 180 °C temperature range. With a Shore C 25–45 hardness and flexible structure, it effectively fills micro-scale surface gaps between components, reducing thermal resistance.

Featuring high dielectric strength (>6 kV/mm) and complying with the UL94 V-0 flame-retardant standard, it delivers both safety and durability. Thanks to its low-oil-bleed formula, it retains stability under high-temperature conditions. Available in thicknesses from 0.5 mm to 6.0 mm, it can be customized in size, color, hardness, and viscosity to match your assembly requirements.

Designed to dissipate heat through indirect contact surfaces in CPUs, GPUs, power modules, and LED systems. For high-performance or direct-die CPU/GPU applications, thermal grease is recommended.