Fehonda® 12.8W/m.K Thermal Pad | Fehonda Premium

Fehonda® 12.8W/m.K Thermal Pad | Fehonda Premium

Maximum Heat Transfer: Fehonda 12.8W/m.K Thermal Pad -with its 12.8 W/m.K conductivity- reliably ensures heat transfer for GPU memory chips (VRAM), power circuitry (VRM), and overclocked devices. Offered between 0.5mm and 3.0mm with a hardness of 30-45 Shore C, these pads provide high flexibility, ensuring perfect conformity to surface irregularities to maximize heat transfer.

Safe Application: The electrically non-conductive structure (Non-conductive) guarantees safe use on sensitive electronic components.

Suitable Application Areas Requiring High Thermal Conductivity:

• Graphics Card (GPU) Memory Chips (VRAM) and Voltage Regulator Modules (VRM)

• Gaming Consoles

• New Generation Battery Packs and Charging Stations

• Chipsets in Mobile Devices

• Frequency Converters (Inverters)

• High-Performance SSDs

Critical Application Note: These thermal pads are designed for high-performance secondary components like VRAM and VRM. Therefore thermal paste should be used on surfaces requiring thermal paste, such as the primary processor die (CPU DIE).

Fehonda Thermal Pads have demonstrated significantly better performance than other thermal pads on the market, as showcased in tests conducted by reputable YouTube channels such as PRO Hi-Tech and Vik-Off. Furthermore, our products are recommended to users by our trusted partners, including OzonRU and GPUFixDE.

• All Fehonda thermal products are manufactured from eco-friendly and non-toxic materials.

• Our quality and processes are certified under the international standards ISO 9001, 14001, and 45001, as well as the product compliance certifications RoHS and Reach.

• The application process for the IATF 16949 automotive quality management system certification is currently in progress.

Feel free to check out our Certification page.