Fehonda® 6.0W Thermal Pad

Fehonda 6.0W Thermal Pad provides advanced thermal management for systems demanding high heat dissipation. Its silicone-based formulation ensures stable performance across a −40 °C to 180 °C temperature range. With a Shore C 30–45 hardness and flexible structure, it effectively fills micro-scale surface gaps between components, reducing thermal resistance.

Featuring high dielectric strength (>6 kV/mm) and complying with the UL94 V-0 flame-retardant standard, it offers both safety and longevity. Thanks to its low-oil-bleed formula, it maintains stability even under high-temperature conditions. Available in thicknesses from 0.5 mm to 6.0 mm, it can be customized in size, color, hardness, and viscosity to meet your specific assembly requirements.

Designed to dissipate heat through indirect contact surfaces in CPUs, GPUs, power modules, and LED systems. For direct-die high-performance CPU/GPU applications, thermal grease is recommended.