Fehonda® 7.0W Thermal Pad

Fehonda® 7.0W Thermal Pad provides reliable thermal management for devices requiring efficient heat dissipation. Its silicone-based formulation ensures stable performance across a –40°C to 180°C temperature range. With a Shore C 30–45 hardness and flexible structure, it effectively fills microscopic surface gaps between components, reducing thermal resistance.

Featuring high dielectric strength (>6 kV/mm) and complying with the UL94 V-0 flame-retardant standard, it offers both safety and durability. Thanks to its low-oil-bleed formula, it maintains stability even under high-temperature conditions. Available in various thicknesses (0.5 mm to 6.0 mm), it can be customized in size, color, hardness, viscosity, and insulation properties to meet specific production requirements. Made from environmentally friendly, non-toxic materials.

It efficiently dissipates heat in laptops, gaming consoles, LED modules, power supplies, telecom equipment, and high-density electronic assemblies, extending component lifespan and preventing performance loss. Designed to dissipate heat through indirect contact surfaces in CPUs, GPUs, power modules, and LED systems. For high-performance or direct-die CPU/GPU applications, thermal grease is recommended.