Fehonda® Thermal Pad Series

Fehonda offers a comprehensive range of thermal pad products with thermal conductivity values ranging from 1.5 W/m·K to 18 W/m·K, providing complete solutions for both industrial and consumer electronics applications under one roof.

Thermal pads fill the gaps between heat-generating components and heat sinks, ensuring maximum efficiency in heat transfer.
This allows system components to maintain optimal operating temperatures, enhances overall performance, and extends the lifespan of electronic circuits.

Fehonda thermal pads deliver outstanding results in high-temperature applications such as high-power semiconductors, VRM modules, memory chips, power converters, LED drivers, and battery management systems (BMS).

Fehonda thermal pads are available in thicknesses ranging from 0.5 mm to 6 mm.
In addition, intermediate sizes such as 0.75 mm, 1.25 mm, and 2.25 mm can also be produced, allowing perfect adaptation to any design or application.

Choosing the Right Product

• Thermal Pads are used when the gap thickness is known.

• Thermal Grease or PCM products are preferred for direct contact surfaces.

• The Fehonda Liquid Thermal Pad series is designed for situations where the gap cannot be measured or the surface is uneven.