Fehonda® PCM8990 is a specialized polymer-system Thermal Phase Change Material designed for high-performance integrated circuits, providing ultra-low thermal resistance by changing phase at 52°C. When the applied surface heats up and reaches 52°C, it melts to fill microscopic surface voids...

Fehonda LTP65 16W/m.K Liquid Thermal Pad is a high-quality thermal putty (dolgu) with 16 W/m.K conductivity that eliminates the difficulty of determining thermal pad thickness. Its optimal viscosity and excellent compliance perfectly seal all gaps, ensuring an effective solution to overhea...

Fehonda LTP81 18W/m.K Liquid Thermal Pad is a high-quality, single-component thermal putty that eliminates the measurement difficulty encountered when determining thermal pad thickness. Featuring optimal viscosity, it is easily applied and effortlessly cleaned from the surface. Its excelle...

Fehonda 12.8W/m.K Thermal Pad -with its 12.8 W/m.K conductivity- reliably ensures heat transfer for GPU memory chips (VRAM), power circuitry (VRM), and overclocked devices. Offered between 0.5mm and 3.0mm with a hardness of 30-45 Shore C, these pads provide high flexibility, ensuring perfe...

Fehonda 15W/m.K Thermal Pad is a high-performance solution with 15 W/m.K thermal conductivity, designed to address overheating issues on GPUs and hot components on the motherboard, such as VRAM and VRMs (Voltage Regulator Modules). It is a safe and electrically non-conductive solution for...

FEHONDA® TG9, with 9.8 W/m·K thermal conductivity, high wettability, and low thermal impedance, provides long-lasting and stable heat transfer at CPU/GPU interfaces. It is a medium-tier cost-effective product in Fehonda’s Premium Series.

FEHONDA® TR50L, with 14.8 W/m·K thermal conductivity, high wettability, and low thermal impedance, provides long-lasting and stable heat transfer at CPU/GPU interfaces. It is a top-tier product in Fehonda’s Premium Series.