5G Base Station Solutions
With the rapid growth of 5G communications, the deployment of 5G small base stations is increasing. Due to miniaturization trends, the density and complexity of electronic assemblies within base stations are also rising.
5G Base Stations
To ensure reliable operation of these electronic components, FEHONDA conductive adhesive can be applied during the casing assembly. It provides strong surface adhesion and forms an effective barrier for EMC/EMI protection.
In areas with high heat generation, such as main chip locations, FEHONDA thermal pads or thermal gel can be added to enhance heat dissipation. This ensures stable performance and improves overall reliability of the base station.